Description: BGA (ball grid array) spherical contact display, one of the surface mount package. Spherical bump the back of the printed substrate produced according to the display mode to replace the pin in front of the printing substrate assembly LSI chip, and then molded resin or potting seal. Also known as the Braille display vector (PAC). Pin can be over 200, is a multi-pin LSI package. The package body can do than QFP (four side-pin flat package) is small. For example, the pin center distance of only 31 for the 360-pin BGA 1.5
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BBGAballgridaG\BGA(ball grid array).pdf
BBGAballgridaG
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