Description: pcb Film Management
Film: The film is exposed in line to do PCB, solder time, PCB surface will be coated with a layer of photosensitive liquid, after test temperature of 80 degrees to dry, and then attached to the PCB board film, and then after UV exposure machine exposure. , tear film. After excess liquid syrup will go, and when to do line-layer welding can be etched into the lines. Pads can be exposed when making solder.
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File list (Check if you may need any files):
5.菲林管理\1.txt
..........\1.xls
..........\MySite.ico
..........\Project1.cfg
..........\Project1.dof
..........\Project1.dpr
..........\Project1.exe
..........\Project1.exe.bak
..........\Project1.res
..........\Project1.~dpr
..........\Unit1.dcu
..........\Unit1.ddp
..........\Unit1.dfm
..........\Unit1.pas
..........\Unit1.~ddp
..........\Unit1.~dfm
..........\Unit1.~pas
..........\Unit2.dcu
..........\Unit2.ddp
..........\Unit2.dfm
..........\Unit2.pas
..........\Unit2.~ddp
..........\Unit2.~dfm
..........\Unit2.~pas
..........\Unit3.dcu
..........\Unit3.ddp
..........\Unit3.dfm
..........\Unit3.pas
..........\Unit3.~ddp
..........\Unit3.~dfm
..........\Unit3.~pas
..........\Unit4.dcu
..........\Unit4.ddp
..........\Unit4.dfm
..........\Unit4.pas
..........\Unit4.~ddp
..........\Unit4.~dfm
..........\Unit4.~pas
..........\Unit5.dcu
..........\Unit5.ddp
..........\Unit5.dfm
..........\Unit5.pas
..........\Unit5.~dfm
..........\Unit5.~pas
..........\Unit6.dcu
..........\Unit6.dfm
..........\Unit6.pas
..........\Unit6.~dfm
..........\Unit6.~pas
..........\w.bmp
..........\wx.txt
..........\z.bmp
5.菲林管理
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