Title:
PCBM_LP_Viewer_V2010(1)(1)
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Description: When using Cadence drawing, need to design packaging. Fortunately have a Mentor Graphics IPC- 7351 LP Viewer 10.2, this a browser software based on IPC- 7351 general standard, can see all kinds of devices of encapsulation.
The IPC- 7351 standard covers all types of passive and active components of bonding pad of graphic design, including resistor, capacitor, MELFS, TSSOPS, QFPS, ball grid array, encapsulation, small square flat without pin shape leadless package, etc. IPC- 7351 for each component provides three solder graphics geometry, namely high cell density, the density of secondary element density, low element, the corresponding CAD software data library is SMM/SMN/SML, respectively is corresponding to the same in every library encapsulation of bonding pad size is not the same as:
High component density SMM: solder is minimal.
Secondary component density SMN: bonding pad.
Low element density SML: bonding pad is biggest, the most strong, for renovation, the most convenient t
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File list (Check if you may need any files):
PCBM_LP_Viewer_V2010(1)\dotNetFx35setup.exe
.......................\PCBM End User License Agreement - FREEWARE.txt
.......................\PCBM_LP_Viewer_V2010.exe
.......................\README - Install Requirements.txt
.......................\安装方法.txt
PCBM_LP_Viewer_V2010(1)
