Description: As programmable logic devices (PLDs) increase in density and I/O pins,
the demand for small packages and diverse packaging options continues
to grow. Ball-grid array (BGA) packages are an ideal solution because the
I/O connections are on the interior of the device, improving the ratio
between pin count and board area. Typical BGA packages contain up to
twice as many connections as quad flat pack (QFP) packages for the same
area. Further, BGA solder balls are considerably stronger than QFP leads,
resulting in robust packages that can tolerate rough handling.
Altera has developed high-density BGA solutions for users of
high-density PLDs. These new formats require less than half the board
space of standard BGA packages.
This application note provides guidelines for designing your printed
circuit board (PCB) for Altera’s high-density BGA packages and
discusses:
■ Overview of BGA Packages
■ PCB Layout Terminology
■ PCB Layout for High-Density BGA Packages
To Search:
File list (Check if you may need any files):
BGA.pdf
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