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DSP 封装说明
DL : 0
关于TI封装的详细介绍
Date
: 2010-11-05
Size
: 488.92kb
User
:
zdking86@gmail.com
[
Other
]
TI Bluetooth
DL : 0
TI关于Bluetooth方案的策略报告
Date
: 2010-11-15
Size
: 182.57kb
User
:
daydayzhq@163.com
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Other
]
omap3530使用手册
DL : 0
北极瑞泰创新科技有限公司与美国TI公司合作推出了ICETEK-OMAP3530-MINI板,用于评估和体验OMAP3X器件的性能的最小系统板
Date
: 2011-01-17
Size
: 8mb
User
:
6076797@163.com
[
Other
]
zigbee 编程指南
DL : 1
ti公司zigbee协议栈的应用,里面包含了多个应用的例子,包括发送接收、下载更新等!
Date
: 2012-06-28
Size
: 2.49mb
User
:
hzy0719@163.com
[
Other
]
Build Your Own LaunchPad
DL : 10
This standard defines the physical and electrical specifications of all TI MCU LaunchPadTM evaluation platforms. Follow these guidelines to maximize success when creating a LaunchPad that supports the BoosterPack ecosystem. Alternatively, these guidelines can also maximize success when creating a BoosterPack that can be plugged into the LaunchPad evaluation kits.
Date
: 2015-05-09
Size
: 392.63kb
User
:
g3133075
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