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关于TI封装的详细介绍
Date : 2010-11-05 Size : 488.92kb User : zdking86@gmail.com

TI关于Bluetooth方案的策略报告
Date : 2010-11-15 Size : 182.57kb User : daydayzhq@163.com

北极瑞泰创新科技有限公司与美国TI公司合作推出了ICETEK-OMAP3530-MINI板,用于评估和体验OMAP3X器件的性能的最小系统板
Date : 2011-01-17 Size : 8mb User : 6076797@163.com

ti公司zigbee协议栈的应用,里面包含了多个应用的例子,包括发送接收、下载更新等!
Date : 2012-06-28 Size : 2.49mb User : hzy0719@163.com

This standard defines the physical and electrical specifications of all TI MCU LaunchPadTM evaluation platforms. Follow these guidelines to maximize success when creating a LaunchPad that supports the BoosterPack ecosystem. Alternatively, these guidelines can also maximize success when creating a BoosterPack that can be plugged into the LaunchPad evaluation kits.
Date : 2015-05-09 Size : 392.63kb User : g3133075
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