- Category:
- SCM
- Tags:
-
[PDF]
- File Size:
- 283kb
- Update:
- 2012-11-26
- Downloads:
- 0 Times
- Uploaded by:
- rjw172
Description: The die has been burned (dice) in the production process, should pay attention to those issues? Ans: 1. Wafers to avoid prolonged exposure to bright light conditions, and pay attention to the production line environment without UV light, etc., so as to avoid ROM data lose or unreliable state. 2. Bonding recommends that customers using ASM AB520 production machine. 3. Customers using appropriate according to the different diameter of the aluminum matrix. (General use 1.0 mil, but according to the size of the different chip pad to do different adjustments) 4. Bonding machine with the appropriate bonding parameters, such as bonding strength of 18 to 26, bonding time of 20 to 28, bonding power 80 ~ 90. (Different bonding machine needs fine-tuning its parameters, customers can do this in control)
To Search:
File list (Check if you may need any files):
关于松翰SONIX系列单片机的一些问题 .pdf
Download