Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.

2011照明用大功率发光二极管封装材料的优化设计.pdf

• We are an exchange download platform that only provides communication channels. The downloaded content comes from the internet. Except for download issues, please Google on your own.
• The downloaded content is provided for members to upload. If it unintentionally infringes on your copyright, please contact us.
• Please use Winrar for decompression tools
• If download fail, Try it againg or Feedback to us.
• If downloaded content did not match the introduction, Feedback to us，Confirm and will be refund.
• Before downloading, you can inquire through the uploaded person information

Nothing．