- Category:
- matlab
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- File Size:
- 81kb
- Update:
- 2015-10-24
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- Uploaded by:
- 宋立军
Description: This case study of a surface patch resistance in a thermal cycle. In general, the solder joint is the weakest link, which usually shows strong nonlinearity in temperature and time. In order to ensure the integrity of the structure, the fatigue analysis is carried out based on the creep strain and dissipation energy.
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surface_mount_resistor.mph
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