PACKAGE CDIP-----Ceramic Dual In-Line Package CLCC

Title: PACKAGE

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SCM
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[PDF]
File Size:
146kb
Update:
2012-11-26
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Uploaded by:
wanderlibi

Description: CDIP-----Ceramic Dual In-Line Package CLCC-----Ceramic Leaded Chip Carrier CQFP-----Ceramic Quad Flat Pack DIP-----Dual In-Line Package LQFP-----Low-Profile Quad Flat Pack MAPBGA------Mold Array Process Ball Grid Array PBGA-----Plastic Ball Grid Array PLCC-----Plastic Leaded Chip Carrier PQFP-----Plastic Quad Flat Pack QFP-----Quad Flat Pack SDIP-----Shrink Dual In-Line Package SOIC-----Small Outline Integrated Package SSOP-----Shrink Small Outline Package

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芯片封装PACKAGE[1].pdf

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