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Description: 美国TI公司的protel 元器件库,在应用中需要更新,本人收集了最新的版本共30M,为提高上传速度分六次上传。文件名依次为TI_1到TI_6。希望大家设计电路板时少走弯路。由于在上传时找不到分类,所以归结为书籍一类-TI' s U.S. Treasury protel components, need to be updated in the application, I collected a total of up-to-date version of 30M, to improve the upload speed upload six hours. File name followed by TI_1 to TI_6. Hope that the design of circuit board less detours. From when can not find in the classification, it comes down to a class of books
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Size: 789504 |
Author: chenxiaoguang |
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Description: 美国TI公司的protel 元器件库,在应用中需要更新,本人收集了最新的版本共30M,为提高上传速度分六次上传。文件名依次为TI_1到TI_6。希望大家设计电路板时少走弯路这里是第二个TI-2-TI' s U.S. Treasury protel components, need to be updated in the application, I collected a total of up-to-date version of 30M, to improve the upload speed upload six hours. File name followed by TI_1 to TI_6. Hope that the design of circuit board less detours here is the second TI-2
Platform: |
Size: 3150848 |
Author: chenxiaoguang |
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Description: 美国TI公司的protel 元器件库,在应用中需要更新,本人收集了最新的版本共30M,为提高上传速度分六次上传。文件名依次为TI_1到TI_6。希望大家设计电路板时少走弯路这里是TI_3-TI' s U.S. Treasury protel components, need to be updated in the application, I collected a total of up-to-date version of 30M, to improve the upload speed upload six hours. File name followed by TI_1 to TI_6. Hope that the design of circuit board is less detours here TI_3
Platform: |
Size: 5859328 |
Author: chenxiaoguang |
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Description: 美国TI公司的protel 元器件库,在应用中需要更新,本人收集了最新的版本共30M,为提高上传速度分六次上传。文件名依次为TI_1到TI_6。希望大家设计电路板时少走弯路 以下是TI_5-TI' s U.S. Treasury protel components, need to be updated in the application, I collected a total of up-to-date version of 30M, to improve the upload speed upload six hours. File name followed by TI_1 to TI_6. Hope that the design of circuit board is less detours following TI_5
Platform: |
Size: 1342464 |
Author: chenxiaoguang |
Hits:
Description: 美国TI公司的protel 元器件库,在应用中需要更新,本人收集了最新的版本共30M,为提高上传速度分六次上传。文件名依次为TI_1到TI_6。希望大家设计电路板时少走弯路以下是TI_6-TI' s U.S. Treasury protel components, need to be updated in the application, I collected a total of up-to-date version of 30M, to improve the upload speed upload six hours. File name followed by TI_1 to TI_6. Hope that the design of circuit board is less detours following TI_6
Platform: |
Size: 1918976 |
Author: chenxiaoguang |
Hits: