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Description: 常用集成电路的封装标准大全：pcb常用封装尺寸：DIP系列、To系列、SOP系列-IC packaging commonly used standard Guinness: pcb common package size: DIP series, To series, SOP series
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Size: 1890304 |
Author: 房贷首付 |
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Description: 全系列芯片封装类型,SOP,QFN,DIP等-Full range of types of chip packaging, SOP, QFN, DIP, etc.
Platform: |
Size: 1890304 |
Author: 张凯 |
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